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IC41C16100S IC41LV16100S
Document Title
1M x 16 bits Dynamic RAM with EDO Page Mode
Revision History
Revision No
0A 0B 0C 0D
History
Initial Draft Revise for typographic Add Pb-free package Change tCOH from 5ns to 4ns
Draft Date
June 5,2001 November 9,2001 May 06,2004 November 26,2004
Remark
The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and products. ICSI will answer to your questions about device. If you have any questions, please contact the ICSI offices.
Integrated Circuit Solution Inc.
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IC41C16100S IC41LV16100S
1M x 16 (16-MBIT) DYNAMIC RAM WITH EDO PAGE MODE
FEATURES
* Extended Data-Out (EDO) Page Mode access cycle * TTL compatible inputs and outputs; tristate I/O * Refresh Interval: Refresh Mode: 1,024 cycles /16 ms RAS-Only, CAS-before-RAS (CBR), and Hidden Self refresh Mode - 1,024 cycles / 128ms * JEDEC standard pinout * Single power supply: 5V 10% (IC41C16100S) 3.3V 10% (IC41LV16100S) * Byte Write and Byte Read operation via two CAS * Industrail Temperature Range -40C to 85C
16-bit high-performance CMOS Dynamic Random Access Memories. These devices offer an accelerated cycle access called EDO Page Mode. EDO Page Mode allows 1,024 random accesses within a single row with access cycle time as short as 20 ns per 16-bit word. The Byte Write control, of upper and lower byte, makes the IC41C16100S ideal for use in 16-, 32-bit wide data bus systems. These features make the IC41C16100Sand IC41LV16100S ideally suited for high-bandwidth graphics, digital signal processing, high-performance computing systems, and peripheral applications. The IC41C16100S and IC41LV16100S are packaged in a 42-pin 400mil SOJ and 400mil 50- (44-) pin TSOP-2.
-50 50 13 25 20 84 -60 60 15 30 25 104 Unit ns ns ns ns ns
DESCRIPTION The ICSI IC41C16100S and IC41LV16100S are 1,048,576 x
KEY TIMING PARAMETERS
Parameter
Max. RAS Access Time (tRAC) Max. CAS Access Time (tCAC) Max. Column Address Access Time (tAA) Min. EDO Page Mode Cycle Time (tPC) Min. Read/Write Cycle Time (tRC) -45 45 11 22 16 77
PIN CONFIGURATIONS
50(44)-Pin TSOP II
VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC NC NC WE RAS NC NC A0 A1 A2 A3 VCC 1 2 3 4 5 6 7 8 9 10 11 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 36 35 34 33 32 31 30 29 28 27 26 GND I/O15 I/O14 I/O13 I/O12 GND I/O11 I/O10 I/O9 I/O8 NC NC LCAS UCAS OE A9 A8 A7 A6 A5 A4 GND
42-Pin SOJ
VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC NC WE RAS NC NC A0 A1 A2 A3 VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 GND I/O15 I/O14 I/O13 I/O12 GND I/O11 I/O10 I/O9 I/O8 NC LCAS UCAS OE A9 A8 A7 A6 A5 A4 GND
PIN DESCRIPTIONS
A0-A9 I/O0-15 WE OE RAS UCAS LCAS Vcc GND NC Address Inputs Data Inputs/Outputs Write Enable Output Enable Row Address Strobe Upper Column Address Strobe Lower Column Address Strobe Power Ground No Connection
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. (c) Copyright 2000, Integrated Circuit Solution Inc.
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IC41C16100S IC41LV16100S
FUNCTIONAL BLOCK DIAGRAM
OE WE LCAS UCAS CAS CLOCK GENERATOR WE CONTROL LOGICS OE CONTROL LOGIC
CAS
WE
OE
RAS
RAS CLOCK GENERATOR
DATA I/O BUS
REFRESH COUNTER
DATA I/O BUFFERS
ROW DECODER
RAS
COLUMN DECODERS SENSE AMPLIFIERS
I/O0-I/O15
MEMORY ARRAY 1,048,576 x 16
ADDRESS BUFFERS A0-A9
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IC41C16100S IC41LV16100S
TRUTH TABLE
Function Standby Read: Word Read: Lower Byte Read: Upper Byte Write: Word (Early Write) Write: Lower Byte (Early Write) Write: Upper Byte (Early Write) Read-Write(1,2) EDO Page-Mode Read(2) RAS H L L L L L L LCAS UCAS H H L L L H H L L H L HL HL LH HL HL HL HL L L H L L L H L L HL HL LH HL HL HL HL L L H L WE X H H H L L L HL H H H L L HL HL H L X X OE X L L L X X X LH L L L X X LH LH L X X X Address tR/tC X ROW/COL ROW/COL ROW/COL ROW/COL ROW/COL ROW/COL ROW/COL ROW/COL NA/COL NA/NA ROW/COL NA/COL ROW/COL NA/COL ROW/COL ROW/COL ROW/NA X I/O High-Z DOUT Lower Byte, DOUT Upper Byte, High-Z Lower Byte, High-Z Upper Byte, DOUT DIN Lower Byte, DIN Upper Byte, High-Z Lower Byte, High-Z Upper Byte, DIN DOUT, DIN DOUT DOUT DOUT DIN DIN DOUT, DIN DOUT, DIN DOUT DOUT High-Z High-Z
EDO Page-Mode Write(1) EDO Page-Mode(1,2) Read-Write Hidden Refresh RAS-Only Refresh CBR Refresh(4)
L 1st Cycle: L 2nd Cycle: L Any Cycle: L 1st Cycle: L 2nd Cycle: L 1st Cycle: L 2nd Cycle: L Read(2) LHL Write(1,3) LHL L HL
Notes: 1. These WRITE cycles may also be BYTE WRITE cycles (either LCAS or UCAS active). 2. These READ cycles may also be BYTE READ cycles (either LCAS or UCAS active). 3. EARLY WRITE only. 4. At least one of the two CAS signals must be active (LCAS or UCAS).
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IC41C16100S IC41LV16100S
Functional Description
The IC41C16100S and IC41LV16100S is a CMOS DRAM optimized for high-speed bandwidth, low power applications. During READ or WRITE cycles, each bit is uniquely addressed through the 16 address bits. These are entered ten bits (A0-A9) at a time. The row address is latched by the Row Address Strobe (RAS). The column address is latched by the Column Address Strobe (CAS). RAS is used to latch the first ten bits and CAS is used the latter ten bits. The IC41C16100S and IC41LV16100S has two CAS controls, LCAS and UCAS. The LCAS and UCAS inputs internally generates a CAS signal functioning in an identical manner to the single CAS input on the other 1M x 16 DRAMs. The key difference is that each CAS controls its corresponding I/O tristate logic (in conjunction with OE and WE and RAS). LCAS controls I/O0 through I/O7 and UCAS controls I/O8 through I/O15. The IC41C16100S and IC41LV16100S CAS function is determined by the first CAS (LCAS or UCAS) transitioning LOW and the last transitioning back HIGH. The two CAS controls give the IC41C16100S and IS41LV16100S both BYTE READ and BYTE WRITE cycle capabilities. addresses and the external address inputs are ignored. CAS-before-RAS is a refresh-only mode and no data access or device selection is allowed. Thus, the output remains in the High-Z state during the cycle.
Self Refresh Cycle
The Self Refresh allows the user a dynamic refresh, data retention mode at the extended refresh period of 128 ms. i.e., 125 s per row when using distributed CBR refreshes. The feature also allows the user the choice of a fully static, low power data retention mode. The optional Self Refresh feature is initiated by performing a CBR Refresh cycle and holding RAS LOW for the specified tRAS. The Self Refresh mode is terminated by driving RAS HIGH for a minimum time of tRP. This delay allows for the completion of any internal refresh cycles that may be in process at the time of the RAS LOW-to-HIGH transition. If the DRAM controller uses a distributed refresh sequence, a burst refresh is not required upon exiting Self Refresh. However, if the DRAM controller utilizes a RAS-only or burst refresh sequence, all 1,024 rows must be refreshed within the average internal refresh rate, prior to the resumption of normal operation.
Memory Cycle
A memory cycle is initiated by bring RAS LOW and it is terminated by returning both RAS and CAS HIGH. To ensures proper device operation and data integrity any memory cycle, once initiated, must not be ended or aborted before the minimum tRAS time has expired. A new cycle must not be initiated until the minimum precharge time tRP, tCP has elapsed.
Extended Data Out Page Mode
EDO page mode operation permits all 1,024 columns within a selected row to be randomly accessed at a high data rate. In EDO page mode read cycle, the data-out is held to the next CAS cycle's falling edge, instead of the rising edge. For this reason, the valid data output time in EDO page mode is extended compared with the fast page mode. In the fast page mode, the valid data output time becomes shorter as the CAS cycle time becomes shorter. Therefore, in EDO page mode, the timing margin in read cycle is larger than that of the fast page mode even if the CAS cycle time becomes shorter. In EDO page mode, due to the extended data function, the CAS cycle time can be shorter than in the fast page mode if the timing margin is the same. The EDO page mode allows both read and write operations during one RAS cycle, but the performance is equivalent to that of the fast page mode in that case.
Read Cycle
A read cycle is initiated by the falling edge of CAS or OE, whichever occurs last, while holding WE HIGH. The column address must be held for a minimum time specified by tAR. Data Out becomes valid only when tRAC, tAA, tCAC and tOEA are all satisfied. As a result, the access time is dependent on the timing relationships between these parameters.
Write Cycle
A write cycle is initiated by the falling edge of CAS and WE, whichever occurs last. The input data must be valid at or before the falling edge of CAS or WE, whichever occurs first.
Power-On
After application of the VCC supply, an initial pause of 200 s is required followed by a minimum of eight initialization cycles (any combination of cycles containing a RAS signal). During power-on, it is recommended that RAS track with VCC or be held at a valid VIH to avoid current surges.
Refresh Cycle
To retain data, 1,024 refresh cycles are required in each 16 ms period. There are two ways to refresh the memory. 1. By clocking each of the 1,024 row addresses (A0 through A9) with RAS at least once every 16 ms. Any read, write, read-modify-write or RAS-only cycle refreshes the addressed row. 2. Using a CAS-before-RAS refresh cycle. CAS-beforeRAS refresh is activated by the falling edge of RAS, while holding CAS LOW. In CAS-before-RAS refresh cycle, an internal 10-bit counter provides the row Integrated Circuit Solution Inc.
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IC41C16100S IC41LV16100S
ABSOLUTE MAXIMUM RATINGS(1)
Symbol VT VCC IOUT PD TA TSTG Parameters Voltage on Any Pin Relative to GND Supply Voltage Output Current Power Dissipation Commercial Operation Temperature Industrial Operationg Temperature Storage Temperature 5V 3.3V 5V 3.3V Rating -1.0 to +7.0 -0.5 to +4.6 -1.0 to +7.0 -0.5 to +4.6 50 1 0 to +70 -40 to +85 -55 to +125 Unit V V mA W C C C
Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND.)
Symbol VCC VIH VIL TA Parameter Supply Voltage Input High Voltage Input Low Voltage Commercial Ambient Temperature Industrial Ambient Temperature 5V 3.3V 5V 3.3V 5V 3.3V Min. 4.5 3.0 2.4 2.0 -1.0 -0.3 0 -40 Typ. 5.0 3.3 -- -- -- -- -- -- Max. 5.5 3.6 VCC + 1.0 VCC + 0.3 0.8 0.8 70 85 Unit V V V C C
CAPACITANCE(1,2)
Symbol CIN1 CIN2 CIO Parameter Input Capacitance: A0-A9 Input Capacitance: RAS, UCAS, LCAS, WE, OE Data Input/Output Capacitance: I/O0-I/O15 Max. 5 7 7 Unit pF pF pF
Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: TA = 25C, f = 1 MHz.
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IC41C16100S IC41LV16100S
ELECTRICAL CHARACTERISTICS(1)
(Recommended Operating Conditions unless otherwise noted.) Symbol Parameter IIL IIO VOH VOL ICC1 Input Leakage Current Output Leakage Current Output High Voltage Level Output Low Voltage Level Standby Current: TTL Test Condition Any input 0V VIN Vcc Other inputs not under test = 0V Output is disabled (Hi-Z) 0V VOUT Vcc IOH = -5.0 mA (5V) IOH = -2.0 mA (3.3V) IOL = 4.2 mA (5V) IOL = 2.0 mA (3.3V) RAS, LCAS, UCAS VIH Commerical Extended ICC2 ICC3 Standby Current: CMOS RAS, LCAS, UCAS VCC - 0.2V 5V 3.3V 5V 3.3V 5V 3.3V -45 -50 -60 -45 -50 -60 -45 -50 -60 -45 -50 -60 -- Speed Min. -5 -5 2.4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max. 5 5 -- 0.4 2 1 3 2 1 0.5 190 160 145 100 90 80 180 160 145 180 160 145 300 Unit A A V V mA mA mA mA
Operating Current: RAS, LCAS, UCAS, Random Read/Write(2,3,4) Address Cycling, tRC = tRC (min.) Average Power Supply Current Operating Current: RAS = VIL, LCAS, UCAS, EDO Page Mode(2,3,4) Cycling tPC = tPC (min.) Average Power Supply Current Refresh Current: RAS Cycling, LCAS, UCAS VIH RAS-Only(2,3) tRC = tRC (min.) Average Power Supply Current Refresh Current: CBR(2,3,5) Average Power Supply Current Self Refresh Current RAS, LCAS, UCAS Cycling tRC = tRC (min.) Self Refresh mode
ICC4
mA
ICC5
mA
ICC6
mA
ICCS
A
Notes: 1. An initial pause of 200 s is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded. 2. Dependent on cycle rates. 3. Specified values are obtained with minimum cycle time and the output open. 4. Column-address is changed once each EDO page cycle. 5. Enables on-chip refresh and address counters.
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IC41C16100S IC41LV16100S
AC CHARACTERISTICS(1,2,3,4,5,6)
(Recommended Operating Conditions unless otherwise noted.) Symbol tRC tRAC tCAC tAA tRAS tRP tCAS tCP tCSH tRCD tASR tRAH tASC tCAH tAR tRAD tRAL tRPC tRSH tRHCP tCLZ tCRP tOD tOE tOED tOEHC tOEP tOES tRCS tRRH tRCH tWCH tWCR tWP tWPZ tRWL tCWL tWCS tDHR 8 Parameter Random READ or WRITE Cycle Time Access Time from RAS(6, 7) Access Time from CAS(6, 8, 15) Access Time from Column-Address(6) RAS Pulse Width RAS Precharge Time CAS Pulse Width(26) CAS Precharge Time(9, 25) CAS Hold Time (21) RAS to CAS Delay Time(10, 20) Row-Address Setup Time Row-Address Hold Time Column-Address Setup Time(20) Column-Address Hold Time(20) Column-Address Hold Time (referenced to RAS) RAS to Column-Address Delay Time(11) Column-Address to RAS Lead Time RAS to CAS Precharge Time RAS Hold Time(27) RAS Hold Time from CAS Precharge CAS to Output in Low-Z(15, 29) CAS to RAS Precharge Time(21) Output Disable Time(19, 28, 29) Output Enable Time(15, 16) Output Enable Data Delay (Write) OE HIGH Hold Time from CAS HIGH OE HIGH Pulse Width OE LOW to CAS HIGH Setup Time Read Command Setup Time(17, 20) Read Command Hold Time (referenced to RAS)(12) Read Command Hold Time (referenced to CAS)(12, 17, 21) Write Command Hold Time(17, 27) Write Command Hold Time (referenced to RAS)(17) Write Command Pulse Width(17) WE Pulse Widths to Disable Outputs Write Command to RAS Lead Time(17) Write Command to CAS Lead Time(17, 21) Write Command Setup Time(14, 17, 20) Data-in Hold Time (referenced to RAS) -45 Min. Max. 77 -- -- -- 45 28 7 7 35 10 0 6 0 6 30 8 23 5 6 37 0 5 3 -- 20 5 10 5 0 0 0 6 40 6 10 11 6 0 39 -- 45 11 22 10K -- 10K -- -- 34 -- -- -- -- -- 23 -- -- -- -- -- -- 13 11 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -50 Min. Max. 84 -- -- -- 50 30 8 9 38 12 0 8 0 8 30 10 25 5 8 37 0 5 3 -- 20 5 10 5 0 0 0 8 40 8 10 13 8 0 39 -- 50 13 25 10K -- 10K -- -- 37 -- -- -- -- -- 25 -- -- -- -- -- -- 15 13 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -60 Min. Max. 104 -- -- -- 60 40 10 9 40 14 0 10 0 10 40 12 30 5 10 37 0 5 3 -- 20 5 10 5 0 0 0 10 50 10 10 15 10 0 39 -- 60 15 30 10K -- 10K -- -- 45 -- -- -- -- -- 30 -- -- -- -- -- -- 15 15 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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AC CHARACTERISTICS (Continued)(1,2,3,4,5,6)
(Recommended Operating Conditions unless otherwise noted.) Symbol tACH tOEH tDS tDH tRWC tRWD tCWD tAWD tPC tRASP tCPA tPRWC tCOH tOFF tWHZ tCLCH tCSR tCHR tORD tREF tREF tT Parameter Column-Address Setup Time to CAS Precharge during WRITE Cycle OE Hold Time from WE during READ-MODIFY-WRITE cycle(18) Data-In Setup Time(15, 22) Data-In Hold Time(15, 22) READ-MODIFY-WRITE Cycle Time RAS to WE Delay Time during READ-MODIFY-WRITE Cycle(14) CAS to WE Delay Time(14, 20) Column-Address to WE Delay Time(14) EDO Page Mode READ or WRITE Cycle Time(24) RAS Pulse Width in EDO Page Mode Access Time from CAS Precharge(15) EDO Page Mode READ-WRITE Cycle Time(24) Data Output Hold after CAS LOW Output Buffer Turn-Off Delay from CAS or RAS(13,15,19, 29) Output Disable Delay from WE Last CAS going LOW to First CAS returning HIGH(23) CAS Setup Time (CBR REFRESH)(30, 20) CAS Hold Time (CBR REFRESH)(30, 21) OE Setup Time prior to RAS during HIDDEN REFRESH Cycle Auto Refresh Period (1,024 Cycles) Self Refresh Period (1,024 Cycles) Transition Time (Rise or Fall)(2, 3) -45 Min. Max. 15 6 0 6 95 55 21 32 16 45 -- 51 4 1.6 3 8 5 8 0 -- -- 1 -- -- -- -- -- -- -- -- -- 100K 27 -- -- 11 10 -- -- -- -- 16 128 50 -50 Min. Max. 15 8 0 8 108 64 26 39 20 50 -- 56 4 1.6 3 10 5 8 0 -- -- 1 -- -- -- -- -- -- -- -- -- 100K 30 -- -- 12 10 -- -- -- -- 16 128 50 -60 Min. Max. 15 10 0 10 133 77 32 47 25 60 -- 68 4 1.6 3 10 5 10 0 -- -- 1 -- -- -- -- -- -- -- -- -- 100K 35 -- -- 15 10 -- -- -- -- 16 128 50 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ms ns
AC TEST CONDITIONS
Output load: Two TTL Loads and 50 pF (Vcc = 5.0V 10%) One TTL Load and 50 pF (Vcc = 3.3V 10%)
Input timing reference levels: VIH = 2.4V, VIL = 0.8V (Vcc = 5.0V 10%); VIH = 2.0V, VIL = 0.8V (Vcc = 3.3V 10%) Output timing reference levels: VOH = 2.0V, VOL = 0.8V (Vcc = 5V 10%, 3.3V 10%)
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IC41C16100S IC41LV16100S
Notes: 1. An initial pause of 200 s is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded. 2. VIH (MIN) and VIL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between VIH and VIL (or between VIL and VIH) and assume to be 1 ns for all inputs. 3. In addition to meeting the transition rate specification, all input signals must transit between VIH and VIL (or between VIL and VIH) in a monotonic manner. 4. If CAS and RAS = VIH, data output is High-Z. 5. If CAS = VIL, data output may contain data from the last valid READ cycle. 6. Measured with a load equivalent to one TTL gate and 50 pF. 7. Assumes that tRCD tRCD (MAX). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase by the amount that tRCD exceeds the value shown. 8. Assumes that tRCD tRCD (MAX). 9. If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear the data output buffer, CAS and RAS must be pulsed for tCP. 10. Operation with the tRCD (MAX) limit ensures that tRAC (MAX) can be met. tRCD (MAX) is specified as a reference point only; if tRCD is greater than the specified tRCD (MAX) limit, access time is controlled exclusively by tCAC. 11. Operation within the tRAD (MAX) limit ensures that tRCD (MAX) can be met. tRAD (MAX) is specified as a reference point only; if tRAD is greater than the specified tRAD (MAX) limit, access time is controlled exclusively by tAA. 12. Either tRCH or tRRH must be satisfied for a READ cycle. 13. tOFF (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. 14. tWCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If tWCS tWCS (MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If tRWD tRWD (MIN), tAWD tAWD (MIN) and tCWD tCWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back to VIH) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled) cycle. 15. Output parameter (I/O) is referenced to corresponding CAS input, I/O0-I/O7 by LCAS and I/O8-I/O15 by UCAS. 16. During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a LATE WRITE or READ-MODIFY-WRITE is not possible. 17. Write command is defined as WE going low. 18. LATE WRITE and READ-MODIFY-WRITE cycles must have both tOD and tOEH met (OE HIGH during WRITE cycle) in order to ensure that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW and OE is taken back to LOW after tOEH is met. 19. The I/Os are in open during READ cycles once tOD or tOFF occur. 20. The first CAS edge to transition LOW. 21. The last CAS edge to transition HIGH. 22. These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READMODIFY-WRITE cycles. 23. Last falling CAS edge to first rising CAS edge. 24. Last rising CAS edge to next cycle's last rising CAS edge. 25. Last rising CAS edge to first falling CAS edge. 26. Each CAS must meet minimum pulse width. 27. Last CAS to go LOW. 28. I/Os controlled, regardless UCAS and LCAS. 29. The 3 ns minimum is a parameter guaranteed by design. 30. Enables on-chip refresh and address counters.
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IC41C16100S IC41LV16100S
READ CYCLE
tRC tRAS tRP
RAS
tCSH tCRP tRCD tRSH tCAS tCLCH tRRH
UCAS/LCAS
tAR tASR tRAD tRAH tRAL tASC tCAH
ADDRESS WE
Row
tRCS
Column
tRCH
Row
tAA tRAC tCAC tCLC tOFF(1)
I/O
Open
tOE
Valid Data
tOD
Open
OE
tOES
Undefined Don't Care
Note: 1. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last.
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IC41C16100S IC41LV16100S
EARLY WRITE CYCLE (OE = DON'T CARE)
tRC tRAS tRP
RAS
tCSH tCRP tRCD tRSH tCAS tCLCH
UCAS/LCAS
tAR tASR tRAD tRAH tASC tRAL tCAH tACH
ADDRESS
Row
Column
tCWL tRWL tWCR tWCS tWCH tWP
Row
WE
tDHR tDS tDH
I/O
Valid Data
Don't Care
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IC41C16100S IC41LV16100S
READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE Cycles)
tRWC tRAS
tRP
RAS
tCSH tCRP tRCD tRSH tCAS tCLCH
UCAS/LCAS
tAR tASR tRAD tRAH tRAL tASC tCAH tACH
ADDRESS
Row
tRCS
Column
tRWD tCWD tAWD
Row
tCWL tRWL tWP
WE
tAA tRAC tCAC tCLZ tDS tDH
I/O
Open
tOE
Valid DOUT
tOD
Valid DIN
Open
tOEH
OE
Undefined Don't Care
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IC41C16100S IC41LV16100S
EDO-PAGE-MODE READ CYCLE
tRASP tRP
RAS
tCSH tCRP tRCD tCAS, tCLCH tCP tPC(1) tCAS, tCLCH tCP tRSH tCAS, tCLCH tCP
UCAS/LCAS
tAR tRAD tASR tASC tCAH tASC tCAH tASC tRAL tCAH
ADDRESS
Row
tRAH tRCS
Column
Column
Column
tRCH
Row
tRRH
WE
tAA tRAC tCAC tCLZ tCAC tCOH tAA tCPA tCAC tCLZ tAA tCPA tOFF
I/O
Open
tOE tOES
Valid Data
Valid Data
tOEHC tOD tOES
Valid Data
tOE
Open
tOD
OE
tOEP
Undefined Don't Care
Note: 1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both measurements must meet the tPC specifications.
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IC41C16100S IC41LV16100S
EDO-PAGE-MODE EARLY-WRITE CYCLE
tRASP
tRP tRHCP
RAS
tCSH tCRP tRCD tCAS, tCLCH tCP tPC tCAS, tCLCH tCP
tRSH tCAS, tCLCH tACH tRAL tCAH
tCP
UCAS/LCAS
tAR tRAD tASR tASC tACH tCAH tASC tACH tCAH tASC
ADDRESS
Row
tRAH
Column
tCWL tWCS tWCH tWP
Column
tCWL tWCS tWCH tWP
Column
tCWL tWCS tWCH tWP
Row
WE
tWCR tDHR tDS tDH tRWL tDS tDH tDS tDH
I/O OE
Valid Data
Valid Data
Valid Data
Don't Care
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IC41C16100S IC41LV16100S
EDO-PAGE-MODE READ-WRITE CYCLE (LATE WRITE and READ-MODIFY WRITE Cycles)
tRASP tRP
RAS
tCSH tCRP tRCD tCAS, tCLCH tCP tPC / tPRWC(1) tCAS, tCLCH tCP tRSH tCAS, tCLCH tCP
UCAS/LCAS
tASR tRAH tAR tRAD tASC tRAL tCAH
tCAH
tASC
tCAH
tASC
ADDRESS
Row
tRWD tRCS
Column
tCWL tWP tAWD tCWD
Column
tCWL tWP tAWD tCWD
Column
tRWL tCWL tWP tAWD tCWD
Row
WE
tAA tRAC tCAC tCLZ tDH tDS tAA tCPA tCAC tCLZ tDH tDS tAA tCPA tCAC tCLZ tDH tDS
I/O
Open
tOE
DOUT
DIN
tOD tOE
DOUT
DIN
tOD tOE
DOUT
DIN
tOD tOEH
Open
OE
Undefined Don't Care
Note: 1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both measurements must meet the tPC specifications.
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Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
IC41C16100S IC41LV16100S
EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODIFY WRITE)
tRASP
tRP
RAS
tCSH tPC tCRP tRCD tCAS tCP tCAS tPC tCP tRSH tCAS tCP
UCAS/LCAS
tASR tRAH tAR tRAD tASC tACH tRAL tCAH
tCAH
tASC
tCAH
tASC
ADDRESS
Row
tRCS
Column (A)
Column (B)
tRCH tWCS
Column (N)
tWCH
Row
WE
tAA tRAC tCAC tCPA tCAC tCOH tAA tWHZ tDS tDH
I/O
Open
tOE
Valid Data (A)
Valid Data (B)
DIN
Open
OE
Don't Care
Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
17
IC41C16100S IC41LV16100S
AC WAVEFORMS READ CYCLE (With WE-Controlled Disable)
tRASP
tRP
RAS
tCSH tPC tCRP tRCD tCAS tCP tCAS tPC tCP tRSH tCAS tCP
UCAS/LCAS
tASR tRAH tAR tRAD tASC tACH tRAL tCAH
tCAH
tASC
tCAH
tASC
ADDRESS
Row
tRCS
Column (A)
Column (B)
tRCH tWCS
Column (N)
tWCH
Row
WE
tAA tRAC tCAC tCPA tCAC tCOH tAA tWHZ tDS tDH
I/O
Open
tOE
Valid Data (A)
Valid Data (B)
DIN
Open
OE
Undefined Don't Care
RAS-ONLY REFRESH CYCLE (OE, WE = DON'T CARE) RAS
tRC tRAS tRP
RAS
tCRP tRPC
UCAS/LCAS
tASR tRAH
ADDRESS I/O
Row Open
Row
Don't Care
18
Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
IC41C16100S IC41LV16100S
CBR REFRESH CYCLE (Addresses; WE, OE = DON'T CARE)
tRP
tRAS
tRP
tRAS
RAS
tRPC tCP tCHR tCSR tRPC tCSR tCHR
UCAS/LCAS I/O Open
HIDDEN REFRESH CYCLE(1) (WE = HIGH; OE = LOW)
tRAS tRP tRAS
RAS
tCRP tRCD tRSH tCHR
UCAS/LCAS
tAR tASR tRAD tRAH tASC tRAL tCAH
ADDRESS
Row
Column
tAA tRAC tCAC tCLZ tOFF(2)
I/O
Open
tOE tORD
Valid Data
Open
tOD
OE
Undefined Don't Care
Notes: 1. A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH. 2. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last.
Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
19
IC41C16100S IC41LV16100S
SELF REFRESH CYCLE (Addresses : WE and OE = DON'T CARE)
tRP VIH RAS VIL tRPC tCP VIH UCAS/LCAS VIL VOH DQ VOL tCHD
tRASS
tRPS
tCSR
tRPC tCP
Open
Don't Care
TIMING PARAMETERS
Symbol tCHD tCP tCSR tRASS tRP tRPS tRPC -45 Min. Max. 8 7 5 100 28 77 5 -- -- -- -- -- -- -- -50 Min. Max. 8 9 5 100 30 84 5 -- -- -- -- -- -- -- -60 Min. Max. 10 9 5 100 40 104 5 -- -- -- -- -- -- -- Units ns ns ns s ns ns ns
ORDERING INFORMATION: 5V (Pb-free) Commercial Range: 0C to 70C
Speed (ns) 45 50 60 Order Part No. IC41C16100S-45K(G) IC41C16100S-45T(G) IC41C16100S-50K(G) IC41C16100S-50T(G) IC41C16100S-60K(G) IC41C16100S-60T(G) Package 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free)
ORDERING INFORMATION: 5V (Pb-free) Industrial Range: -40C to 85C
Speed (ns) 45 50 60 Order Part No. IC41C16100S-45KI(G) IC41C16100S-45TI(G) IC41C16100S-50KI(G) IC41C16100S-50TI(G) IC41C16100S-60KI(G) IC41C16100S-60TI(G) Package 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
20
IC41C16100S IC41LV16100S
ORDERING INFORMATION: 3.3V (Pb-free) Commercial Range: 0C to 70C
Speed (ns) 45 50 60 Order Part No. IC41LV16100S-45K(G) IC41LV16100S-45T(G) IC41LV16100S-50K(G) IC41LV16100S-50T(G) IC41LV16100S-60K(G) IC41LV16100S-60T(G) Package 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free)
ORDERING INFORMATION: 3.3V (Pb-free) Industrial Range: -40C to 85C
Speed (ns) 45 50 60 Order Part No. IC41LV16100S-45KI(G) IC41LV16100S-45TI(G) IC41LV16100S-50KI(G) IC41LV16100S-50TI(G) IC41LV16100S-60KI(G) IC41LV16100S-60TI(G) Package 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free) 400mil SOJ(Pb-free) 400mil TSOP-2(Pb-free)
Integrated Circuit Solution Inc.
HEADQUARTER: NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN, R.O.C. TEL: 886-3-5780333 Fax: 886-3-5783000 BRANCH OFFICE: 7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD, HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C. TEL: 886-2-26962140 FAX: 886-2-26962252 http://www.icsi.com.tw
Integrated Circuit Solution Inc.
DR010-0D 11/26/2004
21

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